sir kasamiko,sinundan ko procedure niyo..na reach kona pinaka taas at pinaka baba ng ferq. naka "u" parin po.?
For the final i already repair a down final of the 02, heres the point, you need a high power /temp soldering iron, mine i use a hakko soldering station set to the highest temp around 480 degrees c. and for better view use a microscope for better view of the solder point, next is a very stable hand. This is the reason for these, the solder point is very narrow, one wrong move you will make the final dead already, you will know if the final is repairable view it from the microscope you will see a cut wire bonded on the gold part substrate. This wire is not soldered but spot welded, thats why when you successfully repair the final after prolong heat or use it will disconnect again. Because the original is wire bonded our repair is solder only. Its worth trying repairing it you will know the inside of the finals same with the rf power module of the mobile rig.Good luck
no way! di yan mag bond sa wafer! technique? tusok lang..then let the cover do the rest..pag isipan nyo..
agree kay sis KASAMIKO , I'm repairing Final Module for 20 years! lol, tsaka pagsunog talaga yung wafer enclosed sa gold area kahit anong tusok mo pa di gagana yan, may modification din para magawa ulit yung module!later ko nalang ipapakita yung pics.!kain muna ako gutom na!